Abstract
ABSTRACTAn analysis of transition from the electrotransport controlled to the creep controlled electromigration (EM) is made for the Blech test geometry. The analysis rests on the approach developed by the authors with relaxation of electromigration induced stress by diffusional creep and non-linear stress distribution along the line. The derived solution confirms the idea of Glickman and Vilenkin that for high current density as the length of the line decreases the transition from the electrotransport controlled to the creep controlled electromigration kinetics must occur. The value of introduced parameter r that relates electromigration behavior to the creep viscosity is estimated by the comparison with experimental observations for aluminum stripes and discussed in terms of the Coble creep mechanisms.
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