Stress measurements in sol-gel films

Abstract

Thin solid films of a wide variety of materials have received increased attention during the past decade. These films have been instrumental in the growth of numerous technologies. Until recently, “thin films” have primarily described layers of metallic or dielectric materials deposited onto substrates by evaporation, electron beam or ion beam techniques. Advances in sol-gel technology have extended film research to include “glassy” materials of either crystalline, or amorphous nature. Sol-gel films can be tailor-made to accommodate a diverse range of applications due primarily to flexibility in chemical make up which determines the respective film's structure. One important characteristic of such films is their inherent residual stress. This inherent stress, and the stress the film introduces to the substrate as it is deposited, can result in a complex stress profile. While “thin” in the case of sol-gel films generally means <1 μm in thickness, large (10–100s of nm of retardance) inherent stress per unit thickness can severely limit a film's performance and subsequent application. We describe our efforts to quantify the residual stress in silica-based sol-gel films as a function of several processing parameters.