Stress intensity factor at the front of 3D-surface crack under transient thermal stress induced by a point heat source

Abstract

A rectangular surface crack perpendicular to the free surface of a three-dimensional solid is assumed and numerically analyzed when the solid surface is heated by an instantaneous point heat source. In particular, the effect of Poisson’s ratio on the distribution characteristics of the stress intensity factor along the crack front is clarified by the body force method. The present analysis is a numerical model for thermal stress laser cleaving of a brittle materials like Si wafer.