Stress-induced transition from vacancy annihilation to void nucleation near microcracks

Abstract

The accumulation of point defects and defect clusters in materials, as seen in irradiated metals for example, can lead to the formation and growth of voids. Void nucleation is derived from the condensation of supersaturated vacancies and depends strongly on the stress state. It is usually assumed that such stress states can be produced by microstructural defects such dislocations, grain boundaries or triple junctions, however, much less attention has been brought to the formation of voids near microcracks. Here, we investigate the coupling between point-defect diffusion/recombination and concentrated stress fields near mode-I crack tips via a spatially-resolved rate theory approach. A modified chemical potential enables point-defect diffusion to be partially driven by the mechanical fields in the vicinity of the crack tip. Simulations are carried out for microcracks using the Griffith model with increasing stress intensity factor KI. Our results show that below a threshold for the stress intensity factor, the microcrack acts purely as a microstructural sink, absorbing point defects. Above this threshold, vacancies accumulate at the crack tip. These results suggest that, even in the absence of plastic deformation, voids can form in the vicinity of a microcrack for a given load when the crack’s characteristic length is above a critical length. While in ductile metals, irradiation damage generally causes hardening and corresponding quasi-brittle cleavage, our results show that irradiation conditions can favor void formation near microstructural stressors such as crack tips leading to lower resistance to crack propagation as predicted by traditional failure analysis.