Abstract
Polymer composites that have high thermal conductivity have become one of the most promising solutions needed to satisfy the thermal management requirements for high-power electrical and electronic equipment. In this work, a strategy relying on aligning carbon fibers through the application of a stress field is proposed. Ultrahigh through-plane thermal conductive epoxy composites with carbon fiber networks have been prepared by in-situ solidification within an epoxy. The thermal conductivity of these epoxy composites reaches as high as 32.6 W m−1 K−1 at 46 wt percent (wt%) of carbon fibers, which is about 171 times that of the pure epoxy. The alignment condition for the carbon fibers for a carbon fiber composite in which stress has been applied and a blended carbon fiber composite are compared using micro compute tomography (micro-CT) and scanning electron microscopy (SEM). These epoxy composites display attractive thermal properties and provide a practical route to satisfy the thermal dissipation requirements raised by the development of modern electrical devices and systems.
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