Stress in Freestanding CVD Diamond Thick Film

Abstract

The present paper describes research on stress in freestanding diamond thick film, diameter of 60mm, prepared on Mo substrate by DC arc plasma jet chemical vapor deposition (DCPCVD) method. The stress in the CVD diamond film was investigated by X-ray diffraction and Raman spectrum. The results show that the stress in the film is compressive. The stress changes little at the same homocentric round. The compressive stress along radial direction is that the stress in the centre of the film is lower than that in the edge at both the final surface and the original surface.