Stress gradient due to incremental forming of bonded metallic laminates

Abstract

ABSTRACTThe residual stress and associated gradient can affect the performance of a material/component during service. Sheet-metal in incremental sheet forming (ISF) due to missing back support may experience high stress gradient across the thickness. The current work is aimed at experimentally analyzing the through-thickness stress gradient in the Cu/steel bonded laminates after ISF deformation. It is found that ISF induces compressive stress gradient, which can be a way greater (about 18 times) than that the rolling process induces in the parent laminates while bonding, specifically when the deformation angle is high. Further, the tool imposes more stress gradient (1–50% depending on the forming conditions) in its motion direction than that in the transverse (or stretching) direction. Moreover, un-strained Cu/steel laminated sheet experiences higher (25%–68%) gradient than that the pre-strained/rolled sheet endures. Regarding the role of technological parameters, high angle, small tool, average step-size and spindle rotation, and low flow-stress induce high stress gradient. The tension tests of the ISFed samples reveal that the post-ISF tensile strength of laminated sheet increases as the stress gradient increases, thus showing a direct relationship between stress gradient and strain hardening in ISF. Finally, models are proposed to predict the stress gradient in the ISFed Cu/steel components.