Stress control of plasma enhanced chemical vapor deposited silicon oxide film from tetraethoxysilane

Abstract

Thin silicon dioxide films have been studied as a function of deposition parameters and annealing temperatures. Films were deposited by tetraethoxysilane (TEOS) dual-frequency plasma enhanced chemical vapor deposition with different time interval fractions of high-frequency and low-frequency plasma depositions. The samples were subsequently annealed up to 930 °C to investigate their stress behavior. Films that were deposited in high-frequency dominated plasma were found to have tensile residual stress after annealing at temperatures higher than 800 °C. The residual stress can be controlled to slightly tensile by changing the annealing temperature. High tensile stress was observed during the annealing of high-frequency plasma-deposited films, leading to film cracks that limit the film thickness, as predicted by the strain energy release rate equation. Thick films without cracks were obtained by iterating deposition and annealing to stack multiple layers. A series of wet cleaning experiments were conducted, and we discovered that water absorption in high-frequency plasma-deposited films causes the residual stress to decrease. A ∼40 nm thick low-frequency deposited oxide cap is sufficient to prevent water from diffusing through the film. Large-area free-standing tensile stressed oxide membranes without risk of buckling were successfully fabricated.