Stress concentration reduction in a plate with a hole using piezoceramic layers

Abstract

The use of piezoelectric patches to reduce stress concentration around a hole in an isotropic plate is investigated. The objective of the research is to reduce stress concentration in the vicinity of the hole without exceeding the reduced stress concentration value anywhere else in the plate. Finite-element analysis is performed on a finite plate with a central circular hole under far-field applied tensile load. Piezoelectric patch placement in the tensile and compressive regions around the hole are considered. It is found that application of an electric field to produce inplane expansion of the piezoelectric patch can alter the compressive zone in such a way that it results in reduction of stress concentration in the tensile zone. For the given geometry, a one-third reduction in stress concentration can be achieved. The results demonstrate the feasibility of reducing stress concentration around a hole by active piezoelectric patches.