Stress Behavior of FCC Metallic Thin Films During Thermal Evaporation

Abstract

The development of stress in metallic thin films, monitored by in-situ curvature measurements during deposition, is analyzed. Three distinct stress regions including initial compressive, broad tensile, and incremental compressive stress were reported in terms of the film thickness (deposition time) by F. Spaepen. An experimental set-up was assembled for the in-situ curvature measurements utilizing vacuum thermal evaporation and multi-beam laser reflection points arrayed in x- and y-axis. The change in the spacing of laser reflected points was converted to the curvature of specimen, in turn, to instantaneous stress levels in the growing films using Stoney's formula. To investigate the effect on the distinct stress regions, the flux of the depositing metallic atoms was used as an experimental variable in this study. For the lowest flux cases for Cu and Ag, an additional second compressive stress stages after tensile maximum stress was observed in this study. Initial compressive part and tensile maximum stress regions appeared in shorter period of time for the thin films deposited at higher flux of atoms. Thus the flux of depositing atoms may affect the mechanisms of each stage. The initial compressive stress is conjectured to stem from the state of thin film surfaces; dynamic and relaxed surface. A broad tensile region is reported from the fact that the reduction of excess volume associated with grain boundaries and/or the coalescence of grains for high mobility materials. The incremental compressive stress region may be related to surface state and atomic mobilities.