Abstract
Residual stress was evaluated by measuring the substrate curvature for alkoxide-derived silica and titania films deposited on silica glass substrates. The residual stress was tensile, increasing with increasing heat-treatment temperature. The stress in fired films was affected greatly by water/alkoxide ratio and chelating agents in starting solutions. Secondly, in situ observation was made on cracking of gel films subjected to heat-treatment. Silica and titania gel films deposited on silicon wafers were cracked in the heating-up stage at temperatures of 100°–400°C, depending on the film thickness and heating rate. Larger thickness and lower heating rates were found to lower the cracking onset temperature. Finally, organic polymers with amide groups were demonstrated to increase the uncracking critical thickness. The polymers include polyvinylpyrrolidone and polyvinylacetamide, allowing single layer ceramic coating films over 1 μm in thickness to be formed without cracking.
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