Abstract
Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys software was used to evaluate the stress response on the PCB plates during the bending process. Two 3D dimensional PCB plate models, one with through hole and one without hole were developed for the simulation. The stress responses from both these models were compared. Simulation results showed that the value of stress response of the PCB increases with increasing displacement. The through hole PCB model exhibited higher stress compared to the without hole PCB model. Highest stress response was obtained at the displacement height of 5cm.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.