Stress Analysis on Through Holes in PCB

Abstract

Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys software was used to evaluate the stress response on the PCB plates during the bending process. Two 3D dimensional PCB plate models, one with through hole and one without hole were developed for the simulation. The stress responses from both these models were compared. Simulation results showed that the value of stress response of the PCB increases with increasing displacement. The through hole PCB model exhibited higher stress compared to the without hole PCB model. Highest stress response was obtained at the displacement height of 5cm.