Abstract
The indentation stress is the key and fundamental parameter in indentation delamination tests, which are widely used in characterization of the interfacial fracture toughness (or adhesion) between a thin film and its substrate. The indentation stress was analyzed in the present work by using the finite element method for microwedge indenters of different wedge angles and with various other geometrical and mechanical parameters including the penetration depth, film thickness, delamination size, Young's modulus, and yield strength of the indented film. The analysis exhibited the stress field under an indentation load and the stress field after unloading caused by plastic deformation, which resulted in the loading indentation stress and the unloading indentation stress, respectively, expressed by empirical formula in terms of the indenter geometry, the indentation depth, and the film thickness and mechanical properties. The energy release rate was also calculated for the indentation-induced interfacial crack.
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