Abstract
A novel composite solder made of Sn-58Bi (in wt%) alloy doped with molybdenum (Mo) nanoparticles was prepared. The effects of Mo nanoparticles on the microstructure and hardness of Sn-58Bi alloy during soldering and isothermal aging were investigated. The results reveal that Mo nanoparticles can significantly refine Bi phase and inhibit Bi atoms diffusing, which is very useful for improving the mechanical properties of Sn-58Bi alloy. The hardness is enhanced in composite solder alloy due to the addition of Mo nanoparticles. It is attributed to the pinning effect of Mo nanoparticles on dislocation movement during deformation.
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