Abstract
The Cu-4Sn and Cu-4Sn-0.15P alloys with rod diameter of 12.5 mm were prepared and then cold drawn to 2.6 mm via multi-pass drawing. The microstructure evolutions, mechanical properties, and electrical conductivity of Cu-4Sn and Cu-4Sn-0.15P alloys were comprehensively analyzed using optical microscope, scanning electron microscope, tension test and electrical conductivity tester. As compared with the P-free alloy, the addition of P can form a new kind of P-rich phase in the Cu-4Sn alloy, and thus refine the casting microstructure via pinning the grain boundary. The toughening mechanisms of P-rich phases in Cu-4Sn-P alloy wires during cold drawing were investigated. With accumulative drawing strain, the spherical P-rich phase gradually changes into fibrous phases, which thus introduce obvious fiber reinforced strengthening. In addition, the distribution of P-rich phase also enhances the< 111 > texture, and promotes the growth of fragmentation zone. It contributes to an improved ultimate tensile strength and final elongation from 664.5 MPa and ∼ 0 % in Cu-4Sn alloy to 970.5 MPa and 1.53 % in Cu-4Sn-0.15P alloy. Finally, the conductivity for Cu-4Sn-0.15P decreases slightly owing to the intensified electron scattering with high amount of primary phase after the addition of P element.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.