Abstract
The pressure reduction of transient liquid phase bonding (TLPB) technique with sound Ti–6Al–4V similar joint is reported. Eliminating brittle intermetallic compounds (microstructural homogenization) and voids at the interface (void closure) is critical for sound joints with bending strength above the yield strength of Ti–6Al–4V. These two goals are achieved by adjusting the holding time (0.5–12 h) and bonding pressure (0.001–0.3 MPa) at a fixed bonding temperature of 950 °C below the phase transus of the substrates. The maximum bending strength of 1570 MPa is obtained with joint having a homogenized microstructure without any voids under joining condition held for 12 h with 0.03 MPa corresponding to 3% of the conventional TLPB technique. The holding time for microstructural homogenization is reduced with 0.3 MPa bonding pressure by liquid push-off from the interface. Low-pressure TLPB is recommended for cost reduction and ensuring shape accuracy of complex geometry components.
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