Abstract
Wafer cleaning represents up to 15% of the total process steps to build an advanced, 90-nm semiconductor device and is still mainly carried out in batch processes. Performance and throughput advantages are the main reasons for the persistence of batch processing in cleaning. However, concerns about cycle time are driving development of single wafer cleaning processes. In this work, improvement in batch process cycle time is demonstrated. This provides an alternative for maintaining performance and throughput while realizing gains in productivity for cleaning processes.
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