Abstract

Nanoscaled bimetallic Cu/Ta multilayers were fabricated and their deformation behaviors characterized under nanoindentation. The individual Cu and Ta layers had equal thickness (∼30 nm) but quite different grain sizes. By evaluating the hardness of the bi-metal system at various strain rates, a transitional point of its strain rate sensitivity at the strain rate of 10 −3 s −1 was observed. Contributions from dislocation and grain boundary (GB) motions to plastic deformation are found to be strongly dependent upon strain rate as well as grain size in alternative constituent layers. Whilst dislocation-mediated motions take up the majority of deformation in a Cu/Ta multilayer at high strain rates, GB motions occurring mainly in the Ta layers take over at low strain rates.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.