Abstract
Fracture experiments with ball grid array (BGA) specimens having different adherend rigidities were performed under bending loads at intermediate strain rates (0.2–1s−1) and a high strain rate of 30s−1. A cohesive zone model (CZM) was established and the predictive capability of the model was assessed for the specimens with different rigidities. The predicted fracture loads were within 12% of the measured forces when the CZM parameters were obtained using specimens with a similar degree of constraint. This suggests that in many practical cases, the effect of adherend stiffness can be neglected in predicting the strength of BGA solder joints.
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