Abstract
To realize the application of ultrafine-grained (UFG) materials in micro-forming, the micro/meso-deformation and fracture behavior of UFG pure copper processed using equal-channel angular pressing were analyzed by making in/ex-situ observations during tensile testing. The evolution of surface cracks and inner voids was apparent in the in-situ scanning electron microscopy (SEM) images and synchrotron radiation X-ray tomograms, respectively. The results indicate that the surface-crack evolution of UFG pure copper can be correlated with strain localization when the flow stress decreases after peaking. The effects of grain size and shear texture on damage evolution during the fracture process are also discussed. This work comprehensively explores the plasticity and fracture/failure mechanisms in UFG Cu samples during the micro-forming process.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
