Strain Hardening Behavior of Laminate Structure With Stable bcc/fcc Bimetal Interfaces

Xuqiang Huang,Zhaoyang Lu,Minghui Cai,Peter D Hodgson

doi:10.3389/fmats.2020.602441

Xuqiang Huang, Zhaoyang Lu + Show 2 more

Open Access

https://doi.org/10.3389/fmats.2020.602441

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Abstract

This work developed a well-bonded bcc/fcc bimetal interphase, which was produced by a two-step process involving diffusion bonding and conventional rolling. The high-quality interface maintained its integrity even at fracture. The earlier tensile instability in the core steel layer was constrained by the neighboring stable Cu layers on both sides, leading to extra strain hardening and consequently higher ductility. An increase in twin density or slip bands and shear deformation between the layers might be the primary causes for the observed hardening behaviors in the near-interface regions.

Highlights

IntroductionA major motivation for manufacturing bimetal materials is to satisfy unique combinations of enhanced properties while reducing the overall cost (Zheng et al, 2013; Beyerlein et al, 2014a; Beyerlein et al, 2014b; Kong et al, 2019; Li et al, 2020; Zhao et al, 2020)
I.e., diffusion bonding, possesses great advantages for joining these dissimilar materials (Zhao et al, 2020), the technique is inappropriate for practical application, especially for large-scale structural materials such as sheets, in part due to the limited dimensions and lower productivity (Guo, 2015)
Further analysis of a high-resolution EBSD image (Figure 1B) reveals that the initial bimetal interface exhibits a continuity of the bond and no dramatic crack or delamination is visible from the bcc Fe to fcc Cu

Summary

Introduction

A major motivation for manufacturing bimetal materials is to satisfy unique combinations of enhanced properties while reducing the overall cost (Zheng et al, 2013; Beyerlein et al, 2014a; Beyerlein et al, 2014b; Kong et al, 2019; Li et al, 2020; Zhao et al, 2020). Accumulative roll-bonding (ARB) (Saito et al, 1999) has been applied to examine the possibility of bonding dissimilar materials, including Ti/Al (Yang et al, 2010), Cu/Ag and Cu/Zr (Ohsaki et al, 2007), Al/Cu (Toroghinejad et al, 2013), with the aim of studying the influence of processing parameters on the interface microstructure and overall mechanical properties. It was found that the interface caused by tensile instability plays a crucial role in the overall strengthening and co-deformability of GS materials. The deformation behavior of the bcc/fcc interface in these bimetallic materials during subsequent plastic deformation has yet to be fully investigated, even though it does play a crucial role in the overall strengthening and co-deformability (Beyerlein et al, 2012; Wu et al, 2014; Ma et al, 2015)

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