Abstract
In the analysis of small structure such as the electronic devices, all of the material properties or dimensions of each component can not be grasped clearly in practice. In this study, uncertain thermal deformation of IC package mounted on the printed circuit board is evaluated by the stochastic finite element analysis based on the first order perturbation technique. In the analysis, the uncertainties of elastic constants, coefficients of thermal expansion and the position error of Si chip are taken into account. The numerical example shows the effect of each uncertain factor on the deformation of package lead related to the thermal fatigue of solder joints. Furthermore, the strain of solder joint is estimated by considering the uncertainty of lead deformation.
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