Abstract
Eutectic gallium indium (E-GaIn) alloy based liquid metal is considered to be a promising material for manufacturing interconnects in stretchable electronics based applications due to its high electrical conductivity and inherent mechanical deformability. The current work demonstrates an easy and single step method of fabricating micron-sized (the width of ~ 200 μm) highly conducting stretchable interconnects by stencil printing of E-GaIn on stretchable polydimethylsiloxane (PDMS) substrate. The obtained stretchable pattern showed excellent electrical and mechanical property by exhibiting a low average resistance value of ~ 6.5 O even at elongation up to 50%. Moreover, it showed superior stability against stretching cycles with just ± 0.12 Ω of variation in resistance. A commercial light emitting diode was mounted on the patterns and illuminated to describe the role of interconnects in a realistic circuit.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
