Abstract
Stencil design plays a major role in the printed circuit board assembly (PCBA) manufacturing process. The design of the stencil often determines the end results in terms of solder bridging, insufficient solder (solder wicking) and component misalignment or displacement. These defects are also the most significant PCBA process defects.1 There are a number of publications dealing with the subject of stencil tolerance, aperture size and shape design. However, there has been little work that addresses the above defects from a fluid solder flow perspective. Thus, this paper examines the important characteristics of different stencil designs based on the consideration of the fundamental fluid mechanical phenomena occurring during solder reflow.
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