Abstract

Raytheon Vision Systems (RVS) is developing two-color and large format single color FPAs fabricated from molecular beam epitaxy (MBE) grown HgCdTe triple layer heterojunction (TLHJ) wafers on CdZnTe substrates and double layer heterojunction (DLHJ) wafers on Si substrates, respectively. MBE material growth development has resulted in scaling TLHJ growth on CdZnTe substrates from 10cm2 to 50cm2, long-wavelength infrared (LWIR) DLHJ growth on 4-inch Si substrates and the first demonstration of mid-wavelength infrared (MWIR) DLHJ growth on 6-inch Si substrates with low defect density ( 70% quantum efficiency, diffusion limited reverse bias dark currents below 300pA and RA products (zero field-of-view, +150mV bias) in excess of 1×103 Ωcm2. Two-color 20μm unit-cell 1280×720 MWIR/LWIR FPAs with pixel response operability approaching 99% have been produced and high quality simultaneous imaging of the spectral bands has been achieved by mating the FPA to a readout integrated circuit (ROIC) with Time Division Multiplexed Integration (TDMI). Large format mega pixel 20μm unit-cell 2048×2048 and 25μm unit-cell 2560×512 FPAs have been demonstrated using DLHJ HgCdTe growth on Si substrates in the short wavelength infrared (SWIR) and MWIR spectral range. Recent imaging of 30μm unit-cell 256×256 LWIR FPAs with 10.0-10.7μm 78K cut-off wavelength and pixel response operability as high as 99.7% show the potential for extending HgCdTe/Si technology to LWIR wavelengths.

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