Abstract
Lightweight SOFC stacks are currently being developed especially for automotive applications such as APU and for portable devices. Within the EU funded project MMLCR=SOFC the Jülich lightweight so-called CS-design was improved concerning better suitability for glass sealing, reduced manufacturing effort and increased power. Based on modelling in combination with manufacturing experience, test results, and post-test analysis substantial changes of the previous CS-design were made. The manufacturing of single parts, particularly due to the improved design of sheet metal interconnects, as well as the assembling processes are suitable for low-cost mass manufacturing. The novel decal concept of glass-ceramic sealant screen printed on foil in order to produce green tapes is used for joining the stack layers offering an enormous potential for cost savings in industrial assembly process. First stack tests with the new CSV–design showed a comparable electrochemical performance to the previous CSIV design having at the same time a better thermo-mechanical behavior.
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