Static recrystallization behavior and strengthening mechanism of a single-phase Cu–18Ni–17Zn alloy

Abstract

The microstructural evolution and recrystallization behavior of a single-phase Cu–18Ni–17Zn alloy during annealing has been investigated. The strengthening effects of the solute atom concentration, grain size, and recrystallized volume fraction have also been studied. The results have shown that the difference in yield strengths for the fully recrystallized samples mainly depended on the grain boundary strengthening effect. This is attributed to a constant (∼41 MPa) solid-solution strengthening contribution in the completely recrystallized Cu–18Ni–17Zn alloy. When compared with pure copper, this alloy exhibited a high Hall-Petch constant (∼0.36 MPa m1/2), which is due to the higher grain boundary interface energy. A discontinuous recrystallization occurred in the alloy in the temperature range 400 °C–500 °C. Furthermore, the yield strength was linearly correlated to the recrystallized volume fraction in the partial recrystallized samples. Moreover, the addition of Ni and Zn increased the recrystallization temperature and slowed the recrystallization kinetics. The activation energy for the recrystallization was estimated as 92.6 ± 5.1 kJ/mol in the cold-rolled Cu–Ni–Zn alloy, which indicates that the grain boundary migration during recrystallization was mainly controlled by diffusion along the grain boundaries. In addition, the recrystallized grains preferentially nucleated at shear bands with high strain energies in the Cu–Ni–Zn alloy during annealing. As the regions of shear banding were completely consumed, new recrystallized nuclei formed at the grain corners. The limited number of nucleation sites resulted in a low Avrami exponent value that ranged from 0.41 to 0.61.