Abstract
This paper introduces a static information model of the cell controller layer for integrated circuit packaging with the unified modelling language (UML). First of all, the die bonder and wire bonder of the IC packaging system were analysed. The information needs of these two machines and the communication interface between them and the connection system were explored. Then the integrated method of the cell controller systems was introduced to establish the information framework of the cell controller. The unified modelling language (UML) is applied, which uses the use case diagram and class diagram to define the function communication interface and relation between the actor of the die bonder and wire bonder. Without first considering the relation between the system's inner structure and the behaviour, the proposed method clearly expressed the functional requirement of the system and the information flow among related systems. Furthermore, the information model of the cell controller layer in the packaging system was established to represent the information flow and communication interface between the IC packaging cell controller and the connecting systems. This can serve as the analysis and design model for system development and information integration in the future.
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