Abstract
Abstract X-ray ptychography, as recent studies show, has the potential to bridge the gap that currently exists between conventional X-ray imaging and electron microscopy. This article covers the evolution of the technology from basic 2D imaging to computed tomography to 3D ptychographic X-ray laminography (PyXL) with zoom. To demonstrate the capabilities of PyXL, a 16-nm FinFET logic IC was mechanically polished to a thickness of 20 µm and several regions were imaged at various levels of resolution.
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