Abstract

Extreme environments such as the Venus atmosphere are among the emerging applications that demand electronics that can withstand high-temperature oxidizing conditions. While wide-bandgap technologies for integrated electronics have been developed so far, they either suffer from gate oxide and threshold voltage ( $V_{th}$ ) degradation over temperature, large power supply requirements, or intrinsic base current. In this letter, AlGaN/GaN high electron mobility transistors (HEMTs) are suggested as an alternative platform for integrated sensors and analog circuits in extreme environments in oxidizing air atmosphere over a wide temperature range from 22°C to 400°C. An optimal biasing region, with a peak of transconductance ( $g_{m,peak}$ ) at −2.3 V with a negligible shift over the temperature range was observed. Moreover, remarkably low $V_{th}$ variation of 0.9% was observed, enabling the design of analog circuits that can operate over the entire temperature range. Finally, the operation of the devices at 400°C and 500°C over 25 hours was experimentally studied, demonstrating the stability of the DC characteristics after the 5 hours of burn-in, at 400°C.

Highlights

  • Wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have proven to be viable candidates for operation in extreme environments due to their superior electronic properties, namely low intrinsic carrier concentration [1], [2]

  • We investigate high-temperature operation of AlGaN/GaN high electron mobility transistor (HEMTs) on Si substrates for analog integrated circuits (ICs) from 22◦C up to 400◦C

  • EXPERIMENTAL RESULTS AND DISCUSSIONS The GaN HEMTs were characterized in air from 22◦C up to 500◦C on a temperature-controlled probe station using an Agilent B1500A semiconductor parameter analyzer

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Summary

Introduction

Wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) have proven to be viable candidates for operation in extreme environments due to their superior electronic properties, namely low intrinsic carrier concentration [1], [2]. The DC characteristics of AlGaN/GaN HEMTs and MIS-HEMTs have been studied up to 600◦C in air for 30 minutes and the HEMTs fail prematurely at 300◦C due to the high gate leakage [30]. We investigate high-temperature operation of AlGaN/GaN HEMTs on Si substrates for analog ICs from 22◦C up to 400◦C.

Results
Conclusion

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