Abstract
The power dissipation levels and the size (footprint) of integrated circuit components that are being assembled to printed circuit boards is causing significant thermal problems that require higher thermal conductivity and close matching of coefficient of thermal expansion. This is especially true when using chip scale devices, chip on board assembly and flip chip on board assembly procedures. AMT has developed a unique printed circuit board that has a thermally conductive layer laminated into the board, which has a thermal conductivity of 225 w/m-k and a very low coefficient of thermal expansion. These properties result in a printed circuit board that is thermally conductive and which has a coefficient of thermal expansion that is closely matched to silicon die and ceramic packages. AMT has demonstrated the benefits of this printed circuit board by conducting thermal cycling tests and vibration tests of boards that were populated with surface mount parts and flip chip on board parts. The testing was conducted under SBIR contracts funded by NASA Glenn Research Center.
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