Abstract
We investigate the heat transfer effect of different types of Nano-fluids on the pin fin heat sinks used in computer’s microprocessor. Nano-particles of Aluminum oxide have been used with volumetric concentrations of 0.002% and Silver oxide with volumetric concentrations of 0.001% in the base fluid of deionized water. We have also used Aluminum oxide with ethylene glycol at volumetric concentrations of 0.002%. We report the cooling rates of Nano-fluids for pin-fin heat to cool the microprocessor and compare these with the cooling rate of pure water. We use a microprocessor heat generator in this investigation. The base temperature is obtained using surface heater of power 130 W. The main purpose of this work is to minimize the base temperature, and increase the heat transfer rate of the water block and radiator. The temperature of the heat sink is maintained at 110 °C which is nearly equal to the observed computer microprocessor temperature. We also provide the base temperature at different Reynolds’s number using the above mention Nano-fluids with different volumetric concentrations.
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