Abstract
The impact of and plasma treatments on the properties of low-dielectric-constant (low-k) carbon-doped silicon oxide (CDO) film, deposited by plasma-enhanced chemical vapor deposition, has been investigated. The thermal stability and the effect of moisture penetration on low-k films have also been evaluated. It is found that and plasma treatments of low-k films result in some loss of C content and increase in moisture uptake. This increases the k value and leakage current of the film. The and plasma treatments do not add any N content in the films. Therefore, it does not cause the resist contamination of chemically amplified-type photoresists. High thermal stability of the low-k CDO material is confirmed by isothermal thermogravimetric analysis of the low-k CDO powder and there is no weight loss or change of composition of the low-k CDO film after seven thermal cycles at 425°C for 1 h in ambient. A pressure cooker test of the film carried out at ∼2 atm, 120°C, and 100% relative humidity for 24 h has been found to increase the k value by 7% and leakage current by two orders of magnitude. © 2004 The Electrochemical Society. All rights reserved.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
