SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration

Abstract

Simultaneous switching noise (SSN) suppression is a serious problem when operating 3-dimentional large-scale integrated circuits (3D LSIs). Thin film capacitors directly connected to LSIs using 3D integration technology are expected to reduce impedance for a power distribution network (PDN). We fabricated various multi-terminal 10 × 10 mm SrTiO 3 thin film capacitors with the capacitance values larger than 1 µF, and explored the impedance in a high frequency region. The equivalent series resistance (ESR) and equivalent series inductance (ESL) values for the metal-insulator-metal (MIM) capacitors are affected by the number of contacts. Typically, the ESR values are less than 1 mΩ and the ESL values are estimated to be a few pH. The SrTiO 3 MIM capacitors on Si interposers are suitable for reducing both self- and transfer-impedance of a PDN for 3D-LSIs.