Abstract
Physical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.
Highlights
The physical vapour deposition (PVD) process has been known for over 100 years, and plasma-assisted PVD was patented about 80 years ago [1]
To obtain better thin film deposition, it is important to know all process steps regarding the equipment related to the reactor, keeping in attention what takes place in the chamber during the deposition cycle
PVD techniques are in constant evolution, accompanying the appearance of new technologies that are being adapted to the processes
Summary
The physical vapour deposition (PVD) process has been known for over 100 years, and plasma-assisted PVD was patented about 80 years ago [1]. It is highly required for functional applications, such as tools, decorative pieces, optical enhancement, PVD is an excellent vacuum coating process for the improvement of wear and corrosion moulds, dies, and blades These are just a few examples of a wide range of already well-established resistance. Among other advantages of thisof the most process, important [32,51,52] Their flexibility and adaptability to market demands led to the development the variation of coating characteristics continuously throughout the film is undoubtedly one and the improvement of techniques theflexibility various and processes and multiple variants arisen, of the most important [32,51,52].
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