Abstract
The results for the sputtering of polycrystalline copper by bombardment with positive ions of He, Li, C, N, O, Ne, Na, Mg, Al, Si, P, S, Cl, Ar, K, Ca, Cu, Zn, Sr, Zr, Cd, J, Hg and Tl are given. In general the sputtering ratio increases with increasing energy and increasing ion mass. For the heavier elements the increase of the sputtering ratios with increasing energy is much faster than for the lighter elements. For N +- and Ne +-ions impinging on copper a relative maximum in the sputtering ratio was found near 15 keV. The angular distribution of the sputtered material has been found to have a Gaussian- rather than a cosine-distribution. This angular distribution is independent of the angle of incidence always symmetrical with respect to the normal on the target surface. The dependence of the sputtering ratio of the angle of incidence was studied. The increase is sharp for very oblique incidence. The sputtering action of N 2 +- and KJ +- molecule ions was investigated.
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