Abstract

Changes in alloy composition which are induced during sputtering at elevated temperatures were studied by Auger electron spectroscopy at different temperatures during sputtering. By using pairs of Auger electrons with different average escape depths, changes in surface composition could be distinguished from subsurface effects. Rapid specimen cooling permitted subsequent room temperature profiling of the subsurface changes induced at elevated temperatures. A sputtering yield ratio S Cu/ S Ni ≈ 2 was determined from measurements of the surface composition of a Cu-40at.%Ni alloy during sputtering with 5 kV Ar + ions; this ratio exhibits little dependence on temperature between 50 and 600 °C. Changes in subsurface composition at elevated temperatures were found to exceed those at the surface and were observed to depths considerably beyond the projected range of the bombarding ions. Measurements of the effect of sputtering rate on the subsurface nickel enrichment are presented. The results support the interpretation that the sputter-induced subsurface maximum in nickel enrichment arises from gibbsian segregation of copper to the external surface at elevated temperatures.

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