Abstract
Since the hexavalent chromium used in chromium electroplating was found to cause cancer in human body, alternative deposition techniques have been widely investigated. Sputter deposition of chromium (Cr) as a deposition technique for replacing electroplating was studied. Effects of RF-power, substrate temperature on the deposition rate, corrosion-resistance, hardness and adhesion strength were investigated. X-ray diffraction (XRD) analysis was performed to determine the structure and the compositions of the films. The hardnesses of the films were measured by using a nanoindenter. The microstructures of the films were observed using scanning electron microscopy. The deposition rate and hardness of the sputter-deposited Cr film tend to increase with the increasing RF-power and substrate temperature of the sputtering process. Both the hardness and adhesion strength of the sputter-deposited chromium film was found to be higher than those of the electroplated chromium film.
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