Abstract
The spreading and wetting behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni lead-free solder on the surface of Cu substrate under ultrasonic vibration were studied by SEM, EDS and other methods. The ultrasonic time was 1, 2, 3, 4, 5 s, respectively and was compared with the spreading of solder in the condition of soldering flux. The results showed that the Sn2.5Ag0.7Cu0.1RE0.05Ni solder was forced to spread instantly on the base metal surface under the action of ultrasonic vibration, and the ultrasonic cavitation can crush the oxide film on the surface of solder and base metal, resulting in the wetting of liquid solder and base metal. When the ultrasonic time was 3 s, the spreading area and spreading ratio of the solder achieved the maximum, and the ultrasonic cavitation could break the β-Sn and eutectic structure of the solder during solidification, refining the microstructure and improving the hardness of the solder matrix.
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