Spray Deposition Methods for Improving Interfacial Strength of Copper–Epoxy Systems

Abstract

A simple spray method using a plain orifice atomizer has been developed for depositing γ-aminopropyltriethoxysilane (APS) from solutions in water and in methanol onto copper surfaces. The evaporative patterns of the sprayed droplets were studied to determine the distribution of deposited APS and the percent coverage of the surface. The peel strengths between copper foil and epoxy resin were measured with and without APS deposition. It was shown that the application of APS resulted in a considerable increase in interfacial adhesion. APS applied from a 1 wt% solution in methanol resulted in a higher peel strength than when applied from a 1 wt% aqueous solution; the opposite was true with 0.2 wt% APS solutions, indicating a trade-off between deposited APS film thickness and surface coverage. In all cases, a higher concentration of APS gives a higher peel strength. APS was very effective when chemisorption occurred at the surface but much less effective when only physisorption took place. A study of the fracture surfaces showed cohesive failure inside the epoxy layer, and that the deposited APS on the copper surfaces had a long-range effect which was seen deep into the epoxy layer, well away from the copper surface.