Abstract

Driving forces of in-plane chain orientation of polyimides (PIs) and their precursors were discussed and the mechanisms were proposed. A polyimide precursor, poly(amic acid) (PAA) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with p-phenylenediamine (PDA) showed a certain degree of in-plane orientation in its solution-casting process and clear molecular weight dependence. The results allowed us to propose the casting-induced in-plane orientation mechanism of the rigid PAA chains. The imidization-induced in-plane orientation mechanism was also discussed by investigating how residual solvent content influences the degree of in-plane orientation of resultant PI films. The results suggested that the magnitudes of the PI chain in-plane orientation are dominated by a combined effect of the initial PAA orientation, apparent stretching based on a great thickness decrease, and the molecular mobility during thermal imidization. In a system derived from s-BPDA with 2,2′-bis(trifluoromethyl)benzidine (TFMB), the effect of molecular mobility during thermal imidization was predominant when cured under usual thermal conditions owing to the presence of the trifluoromethyl groups contributing to weakened intermolecular interaction. In s-BPDA/TFMB and s-BPDA/m-TOL systems (m-TOL = m-tolidine), a melt-induced in-plane orientation phenomenon was observed at temperatures corresponding to their T g’s when the extents of in-plane chain orientation ( f values) were monitored as a function of temperature in the stepwise heating process. This behavior is very curious because there are no appreciable dimensional, morphological, and structural changes as some driving forces just above the T g of s-BPDA/TFMB.

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