Abstract

This paper discusses the growing popularity of silicon on insulator (SOI) technology in the semiconductor industry over the past few years. Of the total share of SOI wafer sales, a small percentage goes to SIMOX (separation by implanted oxygen) process while a large 80% goes to the rival technology developed at Grenoble-based LETI, called Smart Cut. Smart Cut holds the promise of being able to produce high-quality SOI wafers using standard semiconductor processing equipment. Both SIMOX technology and smart cut are able to produce wafers that meet the exacting quality requirements of such companies as IBM and AMD. With the wider availability of quality wafers, SOI has began to move aggressively beyond the confines of the defense and aerospace sectors.

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