Abstract
The metallization of ceramics by means of cold gas spraying (CGS) has been in the focus of numerous publications in the recent past. However, the bonding mechanism of metallic coatings on non-ductile substrates is still not fully understood. Former investigations of titanium coatings deposited on corundum revealed that a combination of recrystallization induced by adiabatic shear processes and hetero-epitaxial growth might be responsible for the high adhesion strengths of coatings applied on smooth ceramic surfaces. In the present work, the interface formation between CGS aluminum and alumina substrates is examined for different particle sizes and substrate temperatures. Furthermore, the influence of subsequent heat treatment on tensile strength and hardness is investigated. The splat formation of single particles is examined by means of scanning electron microscopy, while a high resolution transmission electron microscope is used to study the Al/Al2O3 interface. First results suggest that mechanical interlocking is the primary adhesion mechanism on polycrystalline substrates having the roughness in sub-micrometer range, while the heteroepitaxy between Al and Al2O3 can be considered as the main bonding mechanism for single-crystalline sapphire (α-Al2O3) substrates with the surface roughness in nanometer range. The heteroepitaxial growth is facilitated by deformation-induced recrystallisation of CGS aluminum.
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