Abstract
In this paper, we study the behavior and spreading dynamics of molten metallic alloy droplets. Five solders, including three rare earth elements and a commercial alloy, were used to assess their splashing behavior in terms of the material and impact conditions. The metallic solders were melted down in a heated chamber (oven) and then dripped onto a smooth copper flat substrate as spherical droplets. The impact of each alloy droplet was recorded and analyzed by high-speed imaging and image analysis to obtain the impact speed, the droplet size, and the dynamic contact angle. Our results show that the impact behavior is well parameterized by the splashing ratio, a dimensionless number encompassing the impact and liquid properties, and the maximum dynamic spreading contact angle. Our results are useful to the industry as they provide a criterion to select the maximum soldering injection speed or the droplet size to avoid splashing during soldering or the jetting of molten metals.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
