Abstract
The importance of miniaturisation of hybrid microwave integrated circuits (HMICs) and the increasingly stringent demands on the line‐width control of conductor lines in satellite communications and digital radio systems are well established. The importance of photolithographic processes for achieving accuracy and control of the line width necessary to guarantee performance and repeatability of HMICs is acknowledged. The purpose of this paper is to discuss problems concerning the photoresist deposition process and how spin coating is necessary for obtaining the quality, precision and repeatability required for fine line HMICs for high frequency applications.
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