Abstract
This study presents an investigation on copper oxide (CuO) composited with polyethylene glycol (PEG) thin film. The main objective for this compositing thin film is to explore and determine the characteristic of the thin film when the value of PEG is varied. In this study, PEG plays a role as phase change material (PCM), where this type of material has the capability to absorb and release heat based on its surrounding condition. Due to this characteristic, the amount of PEG is vary from 0.5, 1.0, 1.5 and 2.0 ml to confirm its influence towards CuO thin film. As for comparison, CuO thin film without PEG is also fabricated. Both of the materials used were prepared using sol-gel route and deposited onto indium tin oxide (ITO) substrate using spin coating method. The influences of the PEG values on CuO thin film were investigated using field emission scanning electron microscope (FESEM), x-ray diffraction (XRD), ultra-violet visible microscope (UV-Vis), and current-voltage (IV) measurement. Based on the investigation conducted, the characteristics of CuO thin film produced in this study are affected with the different value of PEG.
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