Spice simulations of DC electrothermal interactions in bipolar electronic circuits

Abstract

This paper is devoted to the problem of analysis of electronic circuits with thermal effects taken into account. Such analysis-called the electrothermal analysis-can be performed by means of the modified SPICE user. In this case the electrothermal analysis demands formulating the electrothermal device models in the proper circuital form. Two types of electrothermal models of the BJT: the global electrothermal model (GETM) and the hybrid electrothermal model (HETM) have been presented. These models were implemented in the form of subcircuits. To make this analysis possible, the STER program supervising SPICE was elaborated.