Abstract
Porous current collectors are conducive to enhance the property of Li metal anode. Unfortunately, congestion in diffusion path during plating process damages the effects of current collectors. Herein, we developed a 3D Cu skeleton with open micrometer-sized pores by NaCl-assisted powder-sintering method. The unobstructed pores of 3D Cu skeleton help to reduce congestion during plating, thus most of Li deposited inside the current collector. Besides, the large smooth surface promotes the deposition of Li with smooth spherical shape, which mitigating Li dendrite growth. As a result, better safety and rechargeability of Li metal anode were achieved in this design.
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