Abstract
Tetrafunctional epoxy resin of bisphenol-C (EBCF) has been cured by various bisamic acids of anhydrides (tetrahydrophthalic anhydride, tetrachlorophthalic anhydride, and tertrabromophthalic anhydride) and diamines (4,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylether, and 4,4′-diaminodiphenyl methane) at 120 °C. Cured resins are found insoluble in common solvents. IR spectral data of cured resins revealed expected groups in polymeric network. Differential scanning calorimetric transitions revealed melting of traces of uncured or branched EBCF and also decomposition reaction. The use of nonstoichiometric amounts of hardeners resulted in about 15–29% sol content and 71–85% gel content except EBCF-TCPADDM for which sol content is considerably high and gel content is low. Cured resins are thermally stable up to about 150–200 °C and followed multistep fractional and integral degradation reactions with 21–48% residue at 700 °C. Halogenated resins displayed somewhat better thermal stability and a large amount of residue. The structure of bisamic acids affected thermal behavior of EBCF. Various kinetic parameters are determined and discussed in light of structure of the bisamic acids.
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