Abstract
Silicon wafers have been submitted to hydrogen RF-plasma treatment in various experimental conditions. Hydrogen RF-plasma treatment induced two kinds of effects on Si wafers, depending on the treatment conditions: surface corrugation and formation of structural defects below the free surface. Atomic force microscopy (AFM) investigations showed that the surface roughness significantly increased with the treatment duration, leading to the formation of pyramidal humps on the surface. The structural defects resulting after the plasma treatments were investigated by conventional and high-resolution transmission electron microscopy (CTEM and HRTEM) techniques. The specificity of the induced extended defects due to hydrogen decoration was emphasized. Three types of extended defects were identified and characterized: planar defects in the {111} and {100} planes and nanometric voids. Point defects related to the hydrogenation process were investigated by electron paramagnetic resonance (EPR) in correlation with the electron microscopy results.
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